• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention relates to a package manufacturing method for improving the reliability of the package by preventing peeling of the plating layer of the outer lead by the bending mold in the bending process. An object of the present invention is to provide a package manufacturing method to improve the electrical short circuit and the solder joint instability of the bent completed external leads. Package manufacturing method according to the present invention for achieving the above object is Molding the lead frame with molding resin; Cutting a dam bar from the molded leadframe; Bending external leads of the lead frame cut in the dam bar; And And plating the outer leads of the bent lead frame.
    公开号:KR19990031588A
    申请号:KR1019970052369
    申请日:1997-10-13
    公开日:1999-05-06
    发明作者:김동옥；유소현；박정식；정정필
    申请人:윤종용；삼성전자 주식회사；
    IPC主号:
    专利说明:

    Package manufacturing method
    The present invention relates to a package manufacturing method, and more particularly, to a package manufacturing method for preventing the peeling of the plating layer of the outer lead by the bending mold in the bending process to improve the reliability of the package.
    As is generally known, after completion of the molding process, the outer leads of the lead frame protrude out of the molding resin and are exposed to the air. When using a package having such outer leads, the outer leads are easily oxidized. Difficult to join to a printed circuit board. Thus, a plating process of forming a plating layer on the surface of the molded outer leads has been performed.
    That is, as shown in FIG. 1, in the step S1, the lead frame 1 for a gulling type package is molded into an encapsulation body 3 of a molding resin. Of course, the outer leads of the lead frame 1 protrude outward of the encapsulation body 3.
    In step S2, a plating layer is plated on a surface of the outer leads of the lead frame 1 to a predetermined thickness. This is to prevent the oxidation of the external leads and the solder joint instability.
    In step S3, a dam bar (not shown) is integrally connected between the plated outer leads using a cutting mold (not shown).
    In step S4, the punch 11 is moved downward to the lower die 13 by using the bending die 10 to latch the outer leads of the lead frame 1 previously placed on the upper surface of the lower die 13. Was bent. Here, a knock out 15 is provided on the lower surface of the punch to support the encapsulation 3 during bending.
    In step S5, the tie bar (not shown) of the lead frame 1 is cut to individualize the gull wing type package.
    However, conventionally, as shown in FIG. 2, the punch 11 of the bending die 10 and the lower die 13 are in close contact with each other in the bending process so that the outer leads of the lead frame 1 are separated from the portions of the lower die 13 ( Bending in the form of 13a). At this time, the plating layer on the lower surface of the outer lead is peeled off by the portion 13a, so that the thickness of the plating layer at the portion 13a is thinner than other portions.
    As the bending process is repeatedly performed, the peeled plating layer is thickly piled on the portion 13a of the lower die 13, and the plating pieces of the stacked plating layers are air blowing or various other dies of the mold die 10. When floating on the surface of the outer leads while floating inside the mold die 10 due to the branching action, electrical short-circuits and defects of the outer leads or defects such as instability of solder joints when the package is mounted on the printed circuit board occur frequently. .
    Accordingly, it is an object of the present invention to provide a method for manufacturing a package to improve the electrical short circuit and the solder joint instability of the bent outer leads.
    1 is a flow chart showing a package manufacturing method according to the prior art.
    Figure 2 is a schematic diagram showing a bending mold applied to the package manufacturing method according to the prior art.
    Figure 3 is a flowchart showing a package manufacturing method according to the present invention.
    Figure 4 is a schematic diagram showing a bending mold applied to the package manufacturing method according to the present invention.
    Figure 5 is a schematic diagram showing a lead frame in a bent state applied to the present invention.
    Explanation of symbols on the main parts of the drawing
    DESCRIPTION OF SYMBOLS 1 Lead frame 3: Encapsulation body 10: Bending mold 11: Punch 13: Lower die 15: Knock out 21: Lead frame 23: Encapsulation body 30: Bending mold 31: Punch 33: Lower die 35: Knock out
    Package manufacturing method according to the present invention for achieving the above object is
    Molding the lead frame with molding resin;
    Cutting a dam bar from the molded leadframe;
    Bending external leads of the lead frame cut in the dam bar; And
    And plating the outer leads of the bent lead frame.
    Hereinafter, a package manufacturing method according to the present invention will be described in detail with reference to the accompanying drawings. The same code | symbol is attached | subjected to the part same as a conventional part.
    Figure 3 is a flowchart showing a package manufacturing method according to the present invention, Figure 4 is a schematic diagram showing a bending mold applied to the package manufacturing method according to the present invention and Figure 5 is a schematic diagram showing a lead frame in a bent state applied to the present invention. to be. For convenience of description, the description will be made with reference to FIGS. 3 to 5.
    As shown in FIG. 3, first, in step S11, a lead frame 21 for a gulling type package is molded into an encapsulation body 23 of a molding resin. Of course, the outer leads of the lead frame 21 are protruding to the outside of the encapsulation 23.
    In step S12, a cut bar (not shown) is used to cut a dam bar (not shown) integrally connected between the plated outer leads.
    In step S13, the punch 31 is moved downward to the lower die 33 by using the bending die 30 to latch the outer leads of the lead frame 21 previously placed on the upper surface of the lower die 33. Bend to Here, the knock out 35 is installed on the lower surface of the punch 31 to support the encapsulation body 23 at the time of bending.
    On the other hand, the lead frame 21 is a dummy tie bar (dummy tie bar) so as to integrally connect the outer ends of the outer leads after cutting of the dam bar (not shown) and bending of the outer lead as shown in FIG. 21a). This is to conduct electricity to the external leads in common when plating the external leads.
    In step S14, the plating layer is plated on the surface of the outer leads of the lead frame 21 protruding horizontally to the side surface of the encapsulation body 23 to a predetermined thickness. This is to prevent the oxidation of the external leads and the solder joint instability.
    In step S15, the tie bar (not shown) and the dummy tie bar 21a of the lead frame 21 are cut to individualize the gull wing type package.
    Therefore, the present invention can be carried out before the plating process to prevent the outer lead plating layer peeling off.
    As described above, in the package manufacturing method according to the present invention, the bending process is first performed on the lead frame after the molding process, and then the plating process is performed. Therefore, the present invention can fundamentally prevent peeling of the plating layer in the bending process to prevent the electrical short circuit of the external leads by the floating plating layer pieces in the air blowing operation of the bending mold, the plating layer of the external leads when mounting the printed circuit board It maintains the thickness of the plating to improve solder joint strength. In addition, the present invention is simple in structure of the bending mold, unlike the prior art, the maintenance of the equipment for bending mold is simple, and the equipment can be reduced in size and light weight is advantageous for the production of small quantity multi-piece package.
    权利要求:
    Claims (2)
    [1" claim-type="Currently amended] Molding the lead frame with molding resin;
    Cutting a dam bar from the molded leadframe;
    Bending external leads of the lead frame cut in the dam bar; And
    Plating the outer leads of the bent lead frame.
    [2" claim-type="Currently amended] The method of claim 1, wherein after the cutting of the dam bar, a dummy tie bar that integrally connects the outer leads remains to enable energization during plating of the outer leads.
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    同族专利:
    公开号 | 公开日
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1997-10-13|Application filed by 윤종용, 삼성전자 주식회사
    1997-10-13|Priority to KR1019970052369A
    1999-05-06|Publication of KR19990031588A
    优先权:
    申请号 | 申请日 | 专利标题
    KR1019970052369A|KR19990031588A|1997-10-13|1997-10-13|Package manufacturing method|
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